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Thermal Contact Resistance and Thermal Conductivity of a Carbon Nanofiber

[+] Author Affiliations
Choongho Yu, Li Shi

University of Texas at Austin, Austin, TX

Alan M. Cassell, Brett A. Cruden, Quoc Ngo, Jun Li

NASA Ames Research Center, Moffett Field, CA

Paper No. HT2005-72320, pp. 197-203; 7 pages
  • ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
  • Heat Transfer: Volume 1
  • San Francisco, California, USA, July 17–22, 2005
  • Conference Sponsors: Heat Transfer Division and Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4731-4 | eISBN: 0-7918-3762-9
  • Copyright © 2005 by ASME


We have used a microfabricated device to measure the thermal contact resistance between a 152-nm-diameter carbon nanofiber and the measurement device, and found that heat conduction models based on Fourier’s law can underestimate the thermal contact resistance at the nanoscale constriction if a large reduction in the effective thermal conductivity of the constriction is not taken into account. With the thermal contact resistance reduced by the deposition of a platinum layer on the contact, we observed that the thermal conductivity of the carbon nanofiber grown by using a plasma enhanced chemical vapor deposition method is comparable to that of graphite fibers grown by pyrolysis of natural gas prior to high-temperature heat treatment.

Copyright © 2005 by ASME



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