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Drop Test and Simulation of Array-Type Multilayer Ceramic Capacitor of Mobile Phone

[+] Author Affiliations
Yang Ho Moon

Samsung Electro-Mechanics Company, Ltd.

Paper No. IMECE2005-82984, pp. 71-75; 5 pages
doi:10.1115/IMECE2005-82984
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Engineering/Technology Management
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Engineering and Technology Management Group
  • ISBN: 0-7918-4230-4 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

MLCC (multilayer ceramic capacitor) is used as electrical parts of computer or mobile phone etc by surface mounting. Drop reliability analysis of MLCC is required for mobile phone because it can be dropped many times when mobile phone used. In this paper when the mobile is dropped, the strain and acceleration are measured and applied to boundary and load condition of simulation. From that result it can be found that the board flex during drop is a major factor that effects on stress in external electrode. From repeated board flex test, drop impact reliability can be estimated.

Copyright © 2005 by ASME
Topics: Ceramics , Simulation , Drops

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