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Mechanical Implications of High Current Densities in Flip Chip Solder Joints

[+] Author Affiliations
Hua Ye, Cemal Basaran, Douglas Hopkins

State University of New York at Buffalo, Buffalo, NY

Paper No. IMECE2002-33650, pp. 477-483; 7 pages
doi:10.1115/IMECE2002-33650
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

The electromigration damage in flip chip solder joints of eutectic SnPb was studied under current stressing at room temperature with the current density about 1.3×104 A/cm2 . The diameter of the solder joints was about 140μm. The mass accumulation near anode side and void nucleation near cathode were observed during current stressing. The nano-indentation test was first time done on solder joints for electromigration test. Surface marker movement was used to measure the atomic flux driven by electromigration and to calculate the product of effective charge number and diffusivity, DxZ*, of the solder at room temperature. The effective charge number can be extracted with the solder diffusivity at room temperature known.

Copyright © 2002 by ASME

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