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Packaging of Single Mode Laser Diodes

[+] Author Affiliations
Peter Bo̸rgesen, Pericles A. Kondos

Universal Instruments, Inc., Binghamton, NY

Vinu Yamunan

Texas Instruments, Dallas, TX

Paper No. IMECE2002-39209, pp. 471-475; 5 pages
doi:10.1115/IMECE2002-39209
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

From a manufacturing perspective optoelectronics packaging is often quite immature and significant optimization still possible. This may, however, require some understanding of the optics as well as of the mechanical and thermal design, materials, and process issues. This is certainly the case for single mode laser diode packaging, where optical alignment and coupling plays a dominant role. Referring to a couple of current generic packages for illustration the present work offers a discussion of some of the manufacturing issues involved and potentials for improvements. This includes alternatives in terms of package design and contents, optical alignment and coupling schemes, and the use of laser welding, soldering, and adhesives.

Copyright © 2002 by ASME
Topics: Lasers , Packaging

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