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Deformation of Conductive Particles and Reliability of Electronic Devices Using COG

[+] Author Affiliations
Takashi Akiguchi

Matsushita Electric Industrial Company, Ltd., Osaka, Japan

Hideo Koguchi, A. Takayasu

Nagaoka University, Nagaoka, Niigata, Japan

M. Yamaguchi

Toyota Auto Body Company, Ltd.

Paper No. IMECE2002-39684, pp. 425-430; 6 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


Following the increasing adoption of TFT-type LCD modules in mobile and other equipment, COG (chip-on-glass) mounting is being increasingly employed instead of TCP (tape carrier package) mounting to make LCD modules smaller, thinner, and cheaper. Since the IC and LCD panel electrodes are bonded together by the conductive particles embedded in ACF (anisotropic conductive film), the bonding conditions depend substantially on the respective characteristics of the IC electrodes and the conductive particles in the ACF. We examined the effects of the arrangement, area and material properties of IC electrodes and of the profile and material properties of conductive ACF particles.

Copyright © 2002 by ASME



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