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High Cycle Vibration Testing of BGA Packages

[+] Author Affiliations
Valmiki K. Sooklal, Michael C. Larson, Xia Liu

Tulane University, New Orleans, LA

Paper No. IMECE2002-39672, pp. 291-296; 6 pages
doi:10.1115/IMECE2002-39672
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

The objective of this work is to develop an experimental apparatus, which will facilitate visual monitoring of the solder joint interconnects in a plastic ball grid array (PBGA) package during cyclic testing. The apparatus has been used to determine crack initiation, crack propagation speed, and joint failure. The experiments are complemented by nonlinear finite element modeling and static strain measurements using moiré interferometry. A representative test is described and the result compared to two model descriptions found in the literature.

Copyright © 2002 by ASME

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