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Optimization of Multiple Head SMT Placement Machine: Model and Approaches

[+] Author Affiliations
Youjiao Zeng, Junqi Yan, Ye Jin, Tao Jiang

Shanghai Jiao Tong University, Shanghai, P. R. of China

Paper No. IMECE2002-39500, pp. 227-232; 6 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


In order to maximize the throughput rate of single multiple head surface mounted technology placement machine, the time taken for pick-and-place of components for each printed circuit board has to be minimized. This gives rise to two related essential problems, namely feeder assignment problem and pick-and-place sequence determination problem. In this paper, we introduce a model that simplifies problems. We regard all components during a pick-and-place cycle as a unit and give it a matching weight. In this way, we change multiple head machine problems into single head machine problems. The optimisation problem becomes two sub-problems: minimum weight matching problem and travelling salesman problem of these units. We presented algorithms to obtain near optimal solution and implement them as a computer program. We performed experiment on a real four head placement machine. The experimental results are presented to analyse their performance.

Copyright © 2002 by ASME



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