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Evaluating the Assembly of Mirrored Large High-Density BGA Packages

[+] Author Affiliations
Joe Chu, Maosen Chen, Wyeman Chen

NSG Technology, Foxconn, San Jose, CA

Paper No. IMECE2002-39499, pp. 215-225; 11 pages
doi:10.1115/IMECE2002-39499
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

The continued emphasis on higher-density (smaller) and better-performance (faster) on electronics system design makes the board (PCB layout) design become more complex and usually will challenge the DFM guidelines currently applied by the industry. For example, the design of mirrored BGAs on double-sided board, which is not recommended by current industry DFM guidelines, due to the real estate constraint. In fact, there are several successful design applying low pin count mirrored or staggered BGAs or CSPs for certain applications, such as memory modules.

Copyright © 2002 by ASME

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