Full Content is available to subscribers

Subscribe/Learn More  >

The Lead-Free Interconnection Movement: A Pro-Active Approach to Understand the Effects on COTS Usage in the Aerospace and Defense Industries

[+] Author Affiliations
Anthony J. Rafanelli

Raytheon Electronic Systems, Portsmouth, RI

Paper No. IMECE2002-39497, pp. 203-213; 11 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


Commercial-off-the-shelf (COTS) items continue to play a significant role in the development and production of defense systems under acquisition reform initiatives. With concerns focussing mainly on top-level performance specifications, end-users do not have the luxury of governing processes used in the manufacture of such items. Accordingly, as the electronics industry proceeds with ever-increasing initiatives in “green” technologies, end-users can expect to find new materials and processes present in COTS products. With respect to electronic interconnection, a specific case is the trend to use alternative materials to lead-bearing solders. Such alternative materials fall into two technology areas: non-lead solders and electrically conductive (polymeric) adhesives. Within commercial applications, these alternate materials have operated sufficiently in relatively benign environments. Since these materials are used as the sole electronic interconnection medium, aerospace and defense original equipment manufacturers (OEMs) need to concern themselves with the overall performance characteristics of these materials in harsher service environments. In this context, performance characteristics include operational and reliability requirements. Note that in surface mount technology, understanding of performance characteristics is of special concern since the interconnection also serves as the primary means of mechanical attachment. The objectives of this paper are: 1. To discuss lead-free evaluative efforts to date, 2. Discuss concerns and approaches, presently under consideration, regarding implementation of these “green” technologies, and 3. Prompt further dialogue in addressing these issues.

Copyright © 2002 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In