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Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy

[+] Author Affiliations
Mohammad Yunus, Muthiah Venkateswaran

Texas Instruments, Dallas, TX

Peter Borgesen

Universal Instruments Corporation, Binghamton, NY

Paper No. IMECE2002-39253, pp. 117-123; 7 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


Usually, flipchip technology is based on either high-Pb or eutectic Sn/Pb solder forming the connections between the semiconductor chip and the carrier substrate. However decay of the 210 Pb constituent, via 210 Bi and 210 Po, to 206 Pb involves the emission of energetic alpha particles which have a tendency to cause soft errors in nearby active elements on the chip. Also, impending legislations in Europe and Japan on the elimination of Pb from electronic products have prompted the investigation of alternative solder alloys. This paper outlines an initial development effort focussed on the Sn/Ag/Cu (95.8/3.5/0.7) alloy. The study involved the development of a flip chip assembly process followed by a reliability evaluation comparing the fatigue resistance of the Sn/Ag/Cu alloy to that of eutectic Sn/Pb solder. The test vehicle used was a 225μm bump pitch, 11mm square die mounted on a ceramic substrate.

Copyright © 2002 by ASME



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