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Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

[+] Author Affiliations
Muthiah Venkateswaran

Texas Instruments, Dallas, TX

Peter Borgesen

Universal Instruments Corporation, Binghamton, NY

K. Srihari

State University of New York, Binghamton, NY

Paper No. IMECE2002-39252, pp. 111-115; 5 pages
doi:10.1115/IMECE2002-39252
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

Electrically conductive adhesives are emerging as a lead free, flux less, low temperature alternative to soldering in a variety of electronics and optoelectronics applications. Some of the potential benefits are obvious, but so far the adhesives have some limitations as well. The present work offers a critical evaluation of one approach to flip chip assembly, which lends itself particularly well to use with a high speed placement machine. Wafers were bumped by stencil printing of a thermoset conductive adhesive, which was then fully cured. In assembly, the conductive adhesive paste was stencil printed onto the pads of a printed circuit board and cured after die placement. The printing process was optimized to ensure robust assembly and the resulting reliability assessed.

Copyright © 2002 by ASME

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