Full Content is available to subscribers

Subscribe/Learn More  >

A Wafer-Level Vacuum Packaging Technology Utilizing Electroplated Nickel

[+] Author Affiliations
Brian H. Stark, Khalil Najafi

University of Michigan, Ann Arbor, MI

Paper No. IMECE2002-39268, pp. 39-44; 6 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


In recent years, there has been an increasing demand for low temperature (<400°C) packaging technologies that can vacuum seal MEMS devices at the wafer level with a minimal amount of wasted die area. Several emerging classes of devices require wafer-level vacuum packaging. There has been growing development of micro-resonators for RF communications systems [1]. The devices require the high Q-factor performance generated by vacuum sealing in order to function as highly selective filters and oscillators. There has also been considerable development in the field of resonant gyroscopes [2], which also require a low pressure ambient for optimal performance. The rapid development of MEMS devices requiring low cost vacuum packaging has outpaced the development of suitable sealing technologies.

Copyright © 2002 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In