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A Wafer-Level Vacuum Packaging Technology Utilizing Electroplated Nickel

[+] Author Affiliations
Brian H. Stark, Khalil Najafi

University of Michigan, Ann Arbor, MI

Paper No. IMECE2002-39268, pp. 39-44; 6 pages
doi:10.1115/IMECE2002-39268
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

In recent years, there has been an increasing demand for low temperature (<400°C) packaging technologies that can vacuum seal MEMS devices at the wafer level with a minimal amount of wasted die area. Several emerging classes of devices require wafer-level vacuum packaging. There has been growing development of micro-resonators for RF communications systems [1]. The devices require the high Q-factor performance generated by vacuum sealing in order to function as highly selective filters and oscillators. There has also been considerable development in the field of resonant gyroscopes [2], which also require a low pressure ambient for optimal performance. The rapid development of MEMS devices requiring low cost vacuum packaging has outpaced the development of suitable sealing technologies.

Copyright © 2002 by ASME

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