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Component Failure Analysis in MEMS Packaging

[+] Author Affiliations
J. Zou, M. Waelti, A. Bowman, J. Marchetti, C. H. Mastrangelo

Corning Intellisense Corporation, Wilmington, MA

Paper No. IMECE2002-39263, pp. 3-8; 6 pages
doi:10.1115/IMECE2002-39263
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3648-7 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

A finite element analysis (FEA) method used to determine the limits of package failure criteria is described. The failure criteria for the micro-electro-mechanical system (MEMS) packages presented here include von Mises, Mohr’s theory, and micro-crack phenomena. In addition, we explore the limits of micro-scale failure criteria on brittle MEMS assemblies. The paper describes stress source identification methods and failure mechanisms for packaged assemblies that can guide MEMS package designers to reduce potential failure modes and improve reliability.

Copyright © 2002 by ASME

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