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Singulation of Electronic Packages With Abrasive Waterjets

[+] Author Affiliations
Mohamed Hashish

Flow International Corporation

Paper No. IMECE2005-79659, pp. 853-861; 9 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Manufacturing Engineering and Materials Handling, Parts A and B
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Manufacturing Engineering Division and Materials Handling Division
  • ISBN: 0-7918-4223-1 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


Abrasive waterjets were used for the first time to commercially singulate electronic chips such as those used for flash memory cards found in digital cameras, cell phones, and USB storage devices. Cutting these components requires high cutting speed, high edge quality, accuracy, and precision. For example, a minimal accuracy needed is about 0.1-mm and a minimum Cpk of 1.33. A relatively small AWJ (~ 0.38 mm) was successfully used to accurately cut chips at speeds of 20 mm/s to 60 mm/s. It was determined that the use of machine vision is critical to meeting the accuracy requirements. The cutting process consisted of piercing starting holes and then cutting shaped pattern cuts to contour the chip components. Drilling holes was performed without delamination and the cutting speed was optimized to meet the intricate chip geometry. Because of the relatively high volume of components to be cut, requiring around the clock duty, process and machine reliability are of critical importance. This paper discusses the results and observation of the cutting process as well as the performance of the system.

Copyright © 2005 by ASME



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