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Three-Dimensional Thermal Analysis for Laser Assisted Milling of Silicon Nitride Ceramics Using FEA

[+] Author Affiliations
Xinwei Shen, W. J. Liu, Shuting Lei

Kansas State University

Paper No. IMECE2005-79245, pp. 445-452; 8 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Manufacturing Engineering and Materials Handling, Parts A and B
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Manufacturing Engineering Division and Materials Handling Division
  • ISBN: 0-7918-4223-1 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


Laser assisted machining (LAM) is one promising method for ceramic machining. In this paper, a three-dimensional heat transfer and thermal stress analysis is completed using commercial FEA software (ANSYS) to gain some insights on the thermal aspects for laser assisted milling. The transient temperature distribution was analyzed for a silicon nitride (Si3 N4 ) ceramic workpiece undergoing a translating laser heat source which simulates the heating environment of the slot-milling operation with LAM. The effects of the operating parameters, such as laser power, laser beam diameter, laser preheat time and laser translating speed, were investigated. The thermal stresses induced from the steep temperature change and the effects of the operating parameters on thermal stresses were investigated. Additionally, the maximum-normal stress failure theory for brittle materials were employed to predict the possibility of cracking on ceramic workpiece due to thermal stresses.

Copyright © 2005 by ASME



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