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Laser-Assisted Nanoscale Material Processing (Invited)

[+] Author Affiliations
Y. F. Lu

University of Nebraska at Lincoln

Paper No. IMECE2005-83047, pp. 1025-1034; 10 pages
doi:10.1115/IMECE2005-83047
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Part B
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4222-3 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

Laser material processing demonstrated its significance in many areas such as microelectronics, data storage, photonics and nanotechnology, since versatile laser sources provide flexible and unique energy source for precise control of material processing. With current laser technology, a short wavelength down to X-ray range and a short pulse duration down to femtosecond range can be achieved. The extreme conditions created by laser irradiation have provided strong impact on material research. To achieve nanoscale laser material machining and processing, we need to overcome the diffraction limit of the laser wavelengths. Recently, different approaches have been explored to overcome the diffraction limit and to achieve feature sizes down to 10 nm order, way beyond the diffraction limits. This paper will provide an overview in the areas of laser-based nanoscale machining and processing, including the author’s own research experience on laser-assisted scanning probe microscope, superfocusing by optical resonance in spherical particles, laser nanoimprinting, laser synthesis of quantum dots, laser annealing of ultrashow pn junctions, nanometer-order film thickness detection using rotational Raman spectroscopy, and laser cleaning of nanoparticles.

Copyright © 2005 by ASME

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