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Heat Transfer in Laser Sintering of Thick-Film Microelectronics

[+] Author Affiliations
Edward C. Kinzel, Xianfan Xu, Hjalti H. Sigmarsson, William J. Chappell

Purdue University

Paper No. IMECE2005-79928, pp. 895-901; 7 pages
doi:10.1115/IMECE2005-79928
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Part B
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4222-3 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

This paper investigates fabrication of functional thick-film components using Selective Laser Sintering (SLS). We demonstrated that SLS has exciting potentials for thick-film metallization of low-temperature substrates. The DC conductivity of laser sintered components is measured for a range of laser scan speeds and powers. The quality of metallization at microwave frequencies is evaluated by comparing the measured Q to simulations. The effects of processing parameters on the quality of components are investigated through a heat transfer analysis of the laser sintering process. Optimum properties of the fabricated components are obtained when proper thermal conditions are achieved during laser heating.

Copyright © 2005 by ASME

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