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Curvature Study With Application in MEMS Packaging

[+] Author Affiliations
Gary Li, Andrew McNeil, Dan Koury, Dave Monk

Motorola, Inc., Tempe, AZ

Paper No. IMECE2002-33400, pp. 395-399; 5 pages
doi:10.1115/IMECE2002-33400
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Microelectromechanical Systems
  • ISBN: 0-7918-3642-8 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

This paper presents a theoretical derivation of curvature equation for a dual stacked structural system whose material properties are temperature dependent. The thickness of the two structural layers are supposed to be in the same magnitude, and the curvature equation for a situation where a thin layer is coated on a thick substrate is given as a special case. The primary goals of this paper are to provide guidance for choosing materials for MEMS sensor packaging and for designing a package aiming at low stress and low deformation.

Copyright © 2002 by ASME

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