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SCREAM for Multi-Level Movable Structures by Inductively Coupled Plasma Process

[+] Author Affiliations
Yu-Hsin Lin, Hung-Ling Yin, Yung-Yu Hsu, Yi-Chiuen Hu, Hsiao-Yu Chou, Tsung-Hsun Yang

National Science Council, Hsinchu, Taiwan, R. O. C.

Paper No. IMECE2002-33382, pp. 347-350; 4 pages
doi:10.1115/IMECE2002-33382
From:
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Microelectromechanical Systems
  • ISBN: 0-7918-3642-8 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME

abstract

A novel fabrication process to etch, to passivate, and to release single-crystal silicon structures totally in just only one process by inductively coupled plasma reactive ion etching (ICP-RIE) has been presented in this paper. Several kinds of movable actuators such as relay, comb-drive, and capacitance with thickness of 30 μm have been fabricated successfully to demonstrate this fabrication process. Here, experimental investigations about fabrication parameters to get well profile and suspension structures are performed in a STS ICP-RIE system.

Copyright © 2002 by ASME

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