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Axiomatic Design of a Chemical Mechanical Polishing (CMP) Wafer Carrier With Zoned Pressure Control

[+] Author Affiliations
Jason W. Melvin, Nam P. Suh

Massachusetts Institute of Technology, Cambirdge, MA

Paper No. IMECE2002-33446, pp. 291-300; 10 pages
  • ASME 2002 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • New Orleans, Louisiana, USA, November 17–22, 2002
  • Conference Sponsors: Microelectromechanical Systems
  • ISBN: 0-7918-3642-8 | eISBN: 0-7918-1691-5, 0-7918-1692-3, 0-7918-1693-1
  • Copyright © 2002 by ASME


Axiomatic Design was used to develop a complete platform for chemical mechanical polishing (CMP) of silicon wafers. A functional requirement of the machine emerging from the axiomatic design process is the control of the wafer-scale polishing uniformity. Mechanisms to maintain control of the uniformity were designed, and integrated into a wafer carrier, which holds the wafer during polishing and applies normal pressure to the polishing interface. The wafer carrier is capable of controlling the pressure in four annular zones on a 200 mm wafer, as well as the pressure of the surrounding retaining ring. Initial testing of the wafer carrier indicates a successful design, offering removal non-uniformity of 1.7% after polishing 5,700 Å of SiO2 from the surface of a silicon wafer.

Copyright © 2002 by ASME



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