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Improved Heat Dissipation Capability on Electronic Motor Control Devices

[+] Author Affiliations
Wei Tong

Danaher Corporation

Paper No. IMECE2005-82857, pp. 183-189; 7 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Part B
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4222-3 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


Heat sinks have been widely used in electronic industry to maintain the operation temperatures of electronic devices lower than their allowable values and thus are often critical to the device performance and life. However, it is difficult to design heat sinks to satisfy all design specifications optimally under complex heat transfer phenomena. The present work discloses a new design of heat sinks to improve heat dissipation capability for electric motor control devices. The heat sink contains a plurality of raindrop-shaped pin fins, acting as vortex generators to increase the rate of heat transfer and in turn, to increase the cooling efficiency of the heat sinks. Numerical results have shown that with the new designed heat sinks, the maximum temperature can reduce about 30% over the conventional heat sinks.

Copyright © 2005 by ASME



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