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Boiling Performance of Flourinert PF 5060 on Confined and Unconfined Wire Meshes Soldered to the Substrate

[+] Author Affiliations
David W. Gerlach, Yogendra K. Joshi

Georgia Institute of Technology

Paper No. IMECE2005-82595, pp. 807-811; 5 pages
doi:10.1115/IMECE2005-82595
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Part A
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4221-5 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

The boiling performance of the dielectric fluorocarbon liquid PF 5060 was measured on submerged 0.9 cm square tin-plated copper and bronze wire meshes soldered to a copper block. Three mesh sizes were tested: 8 wires/cm (20 wires/inch) with 406 micron diameter, 20 wires/cm (50 wires/inch) with 229 micron diameter, and 59 wires/cm (150 × 150 wires/inch) with 66 micron diameter. The curves were measured with top of the mesh open in a pool boiling arrangement and with the mesh covered with a plate so that bubbles must exit sideways.

Copyright © 2005 by ASME
Topics: Wire , Boiling

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