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Optimized Thermal Design for USB-WLAN Module

[+] Author Affiliations
Eason Chen, Jeng Yuan Lai, Ming Zong Wang, Yu-Po Wang, C. S. Hsiao

Siliconware Precision Industries Company, Ltd.

Paper No. IMECE2005-82247, pp. 775-779; 5 pages
doi:10.1115/IMECE2005-82247
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Part A
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4221-5 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

With the increasing demands of wireless network, WLAN modules are developed with various kinds of product patterns; USB type among all is popular for portability. In the market, most USB-WLAN products are made in small form factors that advantage to carry and use as daily portable electronic products. However, the compact size of USB-WLAN elevates the junction temperatures of every package in the module that potentially downgrade the reliability of product. This is a severe challenge for package and module designers that drive a necessity to characterize the thermal behavior from package level to module level to ensure the success of product development. A thermal study was therefore considered for an USB-WLAN module having Baseband, RF and PA packages mounted on a PCB. The characterizations for a commercial USB-WLAN module were conducted with a computational fluid dynamics (CFD) tool to cover the following factors: package design of Base-band and PA, power input level, PCB size and PCB design. The selections of Base-band and PA packages with better Theta_JB performance resulted in better thermal dissipation into PCB. Several power density levels were performed to observe the heat transfer interactions among packages. Different designs of PCB Cu layer, thermal via number and distribution were then investigated in module level simulations for package thermal enhancement. Finally a sample of USB-WLAN module was also built to examine the accuracy of modeling with good agreement.

Copyright © 2005 by ASME
Topics: Design , Wireless LAN

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