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Hot-Spot Thermal Management With Flow Modulation in a Microchannel Heat Sink

[+] Author Affiliations
Poh-Seng Lee, Suresh V. Garimella

Purdue University

Paper No. IMECE2005-79562, pp. 643-647; 5 pages
doi:10.1115/IMECE2005-79562
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Part A
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4221-5 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

Recesses created in the lid of a microchannel heat sink can serve to modulate the flow, resulting in local and global heat transfer enhancement. Numerical analysis of laminar flow and heat transfer in such a modified microchannel heat sink has shown an augmentation of heat transfer without an added penalty of increased pressure drop. The presence of the recesses reduces the overall flow friction and thus pressure drop. The flow expansion into the recesses and the subsequent contraction into the downstream region causes significant local enhancement in heat transfer. Both the maximum and average wall temperatures are decreased as a result. The heat transfer is locally enhanced, by as much as 150% in the regions just downstream of the recesses due to the re-initialization of boundary layers as the flow re-enters the microchannels. The potential for hot-spot mitigation in microelectronics devices using this approach is discussed.

Copyright © 2005 by ASME

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