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Molecular Simulation of the Contact Angle of Water Droplet on a Platinum Surface

[+] Author Affiliations
Bo Shi, Shashank Sinha, Vijay K. Dhir

University of California at Los Angeles

Paper No. IMECE2005-80136, pp. 93-97; 5 pages
doi:10.1115/IMECE2005-80136
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Part A
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4221-5 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

This paper presents a molecular simulation study of the contact angles of water droplets on a platinum surface for a range of temperatures. SPC/E and Z-P model are used for the water-water and water-platinum potentials, respectively. The results show that the contact angle decreases with the increase of system temperatures and increases when the potential decreases. When the temperature is high enough, the contact angles drop to zero degrees. The results were compared with the argon-virtual solid wall and water-Aluminum results, a similar trend was found.

Copyright © 2005 by ASME
Topics: Simulation , Platinum , Water

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