Full Content is available to subscribers

Subscribe/Learn More  >

Thermal System Design and Dislocation Reduction for Growth of Wide Bandgap Crystals

[+] Author Affiliations
R.-H. Ma, H. Zhang, M. Dudley

State University of New York at Stony Brook, Stony Brook, NY

V. Prasad

Florida International University, Miami, FL

Paper No. HT2003-47564, pp. 353-354; 2 pages
  • ASME 2003 Heat Transfer Summer Conference
  • Heat Transfer: Volume 3
  • Las Vegas, Nevada, USA, July 21–23, 2003
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3695-9 | eISBN: 0-7918-3679-7
  • Copyright © 2003 by ASME


In SiC vapor growth, micropipes and dislocations that originate at the seed/boule interface can continuously propagate into the newly grown crystal. They adversely affect the quality of the crystals. The defect density can be reduced by the method of growing a large diameter crystal from a small seed through lateral growth under controlled thermal environment. In this paper, SiC growth processes with varying thermal conditions have been simulated. The effects of operational parameters such as axial and radial temperature gradients, and the presence of polycrystal are also investigated. The current finding can also help in the design of AlN/GaN growth system.

Copyright © 2003 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In