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Numerical Evaluation on the Heat Dissipation Capability of Liquid Metal Based Chip Cooling Device

[+] Author Affiliations
Zhong-Shan Deng, Jing Liu

Chinese Academy of Sciences

Paper No. IMECE2005-80189, pp. 511-515; 5 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


With the sharp improvement in computational speed of CPU, thermal management becomes a major concern in the current microelectronic industry. Conventional thermal management methods for CPU chip cooling are approaching their limit for quite a few newly emerging high integrity and high power processors. Therefore, liquid metal based chip cooling method has been proposed to accommodate to this request. In order to better understand the mechanisms of the cooling enhancement by the liquid metal based cooling technique, the three-dimensional heat transfer process thus involved in the cooling chip is numerically simulated in this study. A series of calculations with different flow rates and thermal parameters are performed. The cooling capability of the liquid metal is also compared with that of the water-cooling system. The results indicate that the liquid metal has powerful cooling capability, which is much better than that of the conventional liquid-cooling system.

Copyright © 2005 by ASME



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