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Thermal Needs and Challenges for the Solid State Lighting Devices: Materials to Packages

[+] Author Affiliations
Mehmet Arik, Stanton Weaver, Anant Setlur, Deborah Haitko

GE Global Research Center

Paper No. IMECE2005-79330, pp. 459-466; 8 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


Light emitting diodes historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards specialty and general illumination applications. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the LED packages and developments in LED power packaging. The luminous efficiency of LEDs is soon expected to reach over 80 Lumens/Watt that is approximately 6 times more than a conventional tungsten bulb. The thermal challenges include but not limited to chip architecture, packaging, phosphors for light conversion, encapsulants and fillers for optical transparency, interconnects for both electrical and thermal reasons. A typical LED power-package has a 1mm2 surface area with a total heat generation of 1 W. This corresponds to a heat flux of 100 W/cm2 , which is much higher than heat fluxes at the current electronics packaging. In this paper, effect of the thermal management on packaging architectures, as well as phosphor and encapsulants are discussed. Discussions on the microscopic defects due to packaging problems as well as chip active layer defects are presented through experimental findings.

Copyright © 2005 by ASME



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