0

Full Content is available to subscribers

Subscribe/Learn More  >

Thermal Needs and Challenges for the Solid State Lighting Devices: Materials to Packages

[+] Author Affiliations
Mehmet Arik, Stanton Weaver, Anant Setlur, Deborah Haitko

GE Global Research Center

Paper No. IMECE2005-79330, pp. 459-466; 8 pages
doi:10.1115/IMECE2005-79330
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

Light emitting diodes historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards specialty and general illumination applications. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the LED packages and developments in LED power packaging. The luminous efficiency of LEDs is soon expected to reach over 80 Lumens/Watt that is approximately 6 times more than a conventional tungsten bulb. The thermal challenges include but not limited to chip architecture, packaging, phosphors for light conversion, encapsulants and fillers for optical transparency, interconnects for both electrical and thermal reasons. A typical LED power-package has a 1mm2 surface area with a total heat generation of 1 W. This corresponds to a heat flux of 100 W/cm2 , which is much higher than heat fluxes at the current electronics packaging. In this paper, effect of the thermal management on packaging architectures, as well as phosphor and encapsulants are discussed. Discussions on the microscopic defects due to packaging problems as well as chip active layer defects are presented through experimental findings.

Copyright © 2005 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In