Full Content is available to subscribers

Subscribe/Learn More  >

An Yield Model for Electronics Assembly

[+] Author Affiliations
N. Gnanasambandam

Pennsylvania State University

M. Munikrishnan, V. Poyyapakkam, K. Srihari

State University of New York at Binghamton

P. Borgesen

Universal Instruments Corporation

Paper No. IMECE2005-82623, pp. 375-380; 6 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


Managing assembly yield in the Printed Circuit Board (PCB) assembly process is crucial in reducing the overall manufacturing cost of a product. Being faced with electronic components that have high interconnect (pin or solder bump) count, density, and complexity, it is extremely important to streamline the manufacturing losses arising from misplaced or poorly assembled components. In order to achieve this goal, yield models are utilized to anticipate and evaluate problems and their causes. This activity could be potentially implemented at the design stage or at least much before the product reaches the manufacturing floor. This research examines some important factors that affect area array (BGA, CSP, flip chip) assembly yields, taking a two-pronged approach to modeling. Achievable yield is classified into placement and assembly components and is estimated using a simulation model.

Copyright © 2005 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In