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Cyclic Mechanical Durability of Sn3.0Ag0.5Cu Pb-Free Solder Alloy

[+] Author Affiliations
Gayatri Cuddalorepatta, Abhijit Dasgupta

University of Maryland

Paper No. IMECE2005-81171, pp. 331-337; 7 pages
doi:10.1115/IMECE2005-81171
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

The isothermal mechanical durability properties of a hypoeutectic, Sn3.0Ag0.5Cu solder are presented and compared to that of near-eutectic Sn3.9Ag0.6Cu and of baseline eutectic Sn37Pb solder. Cyclic mechanical tests are performed at room temperature at various load levels, using a custom-built thermo-mechanical-microscale (TMM) test system. Both the SnAgCu solders are found to outperform the baseline Sn37Pb, with near-eutectic Sn3.9Ag0.6Cu having the best durability. These trends are found to be in agreement with similar results available in the literature for thermal cycling durability. Fatigue results are presented in terms of both cyclic strain range and cyclic work dissipation. The effect of microstructural coarsening resulting from long-term aging at room temperature is investigated by conducting similar tests at room temperature, on the aged samples. The durability of the hypoeutectic SnAgCu solder reduced on aging, with the drop being more significant for damage curves based on cyclic work dissipation, than on cyclic inelastic strain range.

Copyright © 2005 by ASME

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