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Thermal-Mechanical Analysis of a Flip-Chip VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (SnBi) Solder Joints

[+] Author Affiliations
John Lau, Walter Dauksher

Agilent Technologies, Inc.

Paper No. IMECE2005-79981, pp. 299-324; 26 pages
doi:10.1115/IMECE2005-79981
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

To perform Failure Analysis of an 1657CCGA package on PCB with OSP (Organic Solderability Preservative) surface finish.

Copyright © 2005 by ASME

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Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

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