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Realizing 3-D Interconnected Direct Write Electronics Within Smart Stereolithography Structures

[+] Author Affiliations
Jeremy A. Palmer, Donald W. Davis, Phillip L. Gallegos, Bart D. Chavez, Pin Yang

Sandia National Laboratories

Jeffrey L. Summers

MicroSat Systems, Inc.

Francisco Medina, Ryan B. Wicker

University of Texas at El Paso

Paper No. IMECE2005-79360, pp. 287-293; 7 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


Research in rapid prototyping of high-density circuitry (RPHDC) involves integrating direct write (DW) conductive ink dispensing technology with stereolithography (SL) to manufacture smart structural members with integrated three-dimensional electronics. A significant challenge in this effort is realizing practical three-dimensional interconnect for discrete electronic packages encapsulated within a SL matrix. This paper presents research into SL-encapsulated DW three-dimensional interconnect. Results suggest that robust three-dimensional electronics are possible within an integrated DWSL structure. A power supply circuit is demonstrated that converts a 28 VDC input to a 5 VDC output with electromagnetic interference filtering capability. Additional work is necessary to improve resistance of DW interconnect, and planarity of device planes. Strategies for improving resistance of DW ink through localized laser curing and thermal curing are discussed in addition to the encapsulation performance of advanced SL resins. Future work in this area may impact the widely accepted MCM-L and MCM-C multichip module technologies.

Copyright © 2005 by ASME



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