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Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives

[+] Author Affiliations
Dan O. Popa, Abiodun Fasoro, Heather Beardsley, Jeongsik Sin, Woo Ho Lee, Raul Fernandez

University of Texas at Arlington

Michael Deeds

NAVSEA Indian Head Division

Paper No. IMECE2005-82970, pp. 285-286; 2 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


In this paper we describe two modular automated microassembly systems, along with a several packaging processes that have been integrated to produce reliable and cost-effective MOEMS devices. The automated and packaging systems consists of robotics such as pick and place, insertion and fastening, machine vision and controls, and processes such as die attach, solder reflow by laser, wire bonding and seam sealing. The target MOEMS devices are intended for applications requiring a minimum twenty year shelf-life.

Copyright © 2005 by ASME



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