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Thermal Stress Analysis for Differential Pressure Sensors

[+] Author Affiliations
J. Albert Chiou, Steven Chen

Motorola, Inc.

Paper No. IMECE2005-82946, pp. 273-278; 6 pages
doi:10.1115/IMECE2005-82946
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

Pressure sensors should be capable of measuring pressure accurately and consistently without being disturbed by the temperature environment. With silicon’s better thermal material properties, silicon micormachined pressure sensors are mass-produced and widely used. However, a silicon pressure sensing element has to be packaged and protected. The thermal mismatching between the sensing element and packaging may generate stresses on the transducer of a sensing element and create thermal hysteresis and voltage shift during temperature cycling. The induced thermal stresses can easily deteriorate performance reliability. In this paper, finite element analyses and experimental tests were conducted to reduce the thermal stress and thermal hysteresis. With the glass substrate to isolate the stress from plastic housing, the thermal hysteresis can be significantly improved. The die placement and dispense pattern can be also optimized to further improve the thermal hysteresis.

Copyright © 2005 by ASME

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