0

Full Content is available to subscribers

Subscribe/Learn More  >

A Room-Temperature Bonding Technique Using Ultrathin PDMS as an Intermediate Layer for Fabrication of Micron and Submicron Channels

[+] Author Affiliations
Yonduck Sung, Yongjun Zhao, Qiao Lin

Carnegie Mellon University

Paper No. IMECE2005-82824, pp. 269-272; 4 pages
doi:10.1115/IMECE2005-82824
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

We present a new room-temperature bonding technique using a submicron-thick PDMS as an intermediate adhesive bonding layer for fabrication of micron and submicron-scale channels. The ultrathin bonding layers were created with spin-coating of PDMS dissolved in toluene at various weight ratios from 1:4 to 1:18 (PDMS:toluene) to obtain layer thicknesses from 1.65 μm to 0.10 μm, respectively. Bonding of discrete parts of microchannel was formed under pressure with a clamping vise at room-temperature. Tensile bonding strength test on this new technique showed excellent bonding strength. We have achieved 310 kPa for a 0.1 μm-thick layer with the aid of oxygen plasma treatment. To demonstrate its utility in micron and submicron channel fabrication, we created channels (970 μm × 60 μm × 0.97 μm) and performed leakage tests. The bonding showed no leakage at pressures up to 210 kPa.

Copyright © 2005 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In