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A Room-Temperature Bonding Technique Using Ultrathin PDMS as an Intermediate Layer for Fabrication of Micron and Submicron Channels

[+] Author Affiliations
Yonduck Sung, Yongjun Zhao, Qiao Lin

Carnegie Mellon University

Paper No. IMECE2005-82824, pp. 269-272; 4 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


We present a new room-temperature bonding technique using a submicron-thick PDMS as an intermediate adhesive bonding layer for fabrication of micron and submicron-scale channels. The ultrathin bonding layers were created with spin-coating of PDMS dissolved in toluene at various weight ratios from 1:4 to 1:18 (PDMS:toluene) to obtain layer thicknesses from 1.65 μm to 0.10 μm, respectively. Bonding of discrete parts of microchannel was formed under pressure with a clamping vise at room-temperature. Tensile bonding strength test on this new technique showed excellent bonding strength. We have achieved 310 kPa for a 0.1 μm-thick layer with the aid of oxygen plasma treatment. To demonstrate its utility in micron and submicron channel fabrication, we created channels (970 μm × 60 μm × 0.97 μm) and performed leakage tests. The bonding showed no leakage at pressures up to 210 kPa.

Copyright © 2005 by ASME



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