Full Content is available to subscribers

Subscribe/Learn More  >

Strain-Based Flexure Assessment for the Printed Circuit Board Assembly Environment

[+] Author Affiliations
W. Carter Ralph, Frank W. Joyce

Intel Corporation

Paper No. IMECE2005-82565, pp. 147-153; 7 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


Mechanical damage to due to over-flexure is an increasing concern in the printed circuit board assembly environment. This damage can result in part rejection during manufacturing, or may combine with other failure mechanisms to result in field returns. Therefore, flexure control during circuit board assembly is a vital part of overall product quality. A metric has been developed for component-specific strain-based flexure limits using a spherical bend mode and a novel strain metric, along with a detailed method for strain gage measurement in the assembly environment. This paper presents a review of the trends that have contributed to the increased risk of damage, as well as the development of the diagonal strain metric and the use of the spherical bend mode. These methods have been successfully employed to identify excessive flexure and reduce risks to function and reliability. Two case studies that demonstrate the application and effectiveness of the procedures are presented.

Copyright © 2005 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In