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Integrated Reliability Solutions for New Component Development and Designs Optimization

[+] Author Affiliations
Xiaohua Wu, Zhengfang Qian, Yinyan Wang

Motorola, Inc.

Paper No. IMECE2005-82320, pp. 131-137; 7 pages
doi:10.1115/IMECE2005-82320
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

New engine control module products require most reliable, smallest pad size for new 0402 leadless components implementation. Cycle time and cost reduction is the major demand in the new product prototype development and design of experiments. An integrated quality and reliability modeling methodology has been applied for evaluating the new leadless component pad stack designs in PWB/Rigidizer engine module products for optimal process solderability and reliability performance. Simulations combine analyses of process defect root cause, high volume manufacturability, and thermal fatigue life to derive optimal design solutions of pad stack and manufacturing process requirement. This integrated quality and reliability simulations has enabled a significant cycle time reduction by performing virtual design of experiments for the new component pad stack designs.

Copyright © 2005 by ASME

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