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Experimental Investigation of the Effect of Reflow Cooling Rate on the IMC Growth of SAC Lead-Free Solder Alloy

[+] Author Affiliations
Fubin Song, S. W. Ricky Lee

Hong Kong University of Science and Technology

Paper No. IMECE2005-82095, pp. 123-129; 7 pages
doi:10.1115/IMECE2005-82095
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

The present research is conducted to investigate a critical issue for Lead-free solder alloy. Near-ternary eutectic Sn-Ag-Cu alloys have been studied since they are the leading Lead-free candidate solders for various applications. There are three main phases in the near-ternary eutectic alloys: β-Sn rich phase, Ag3 Sn and Cu6 Sn5 . Cooling rate is an important processing factor that affects the microstructure of these alloys and then significantly influences mechanical behavior of the Sn-Ag-Cu solder joints. It is demonstrated that the amount and size of large Ag3 Sn plates increase with decreasing of the cooling rate. When large Ag3 Sn plates present in the solder joints at the lower cooling rate, they may affect the mechanical integrity of the joints by providing a crack initialization during the mechanical testing under room-temperature condition. In the present paper, the effects of cooling rate on the microstructure and mechanical properties are studied on Sn-3.8Ag-0.7Cu solder ball, including shear strength and ball pull test. There are two kinds of fracture mode for Ag3 Sn plates preformed mechanical loading in room-temperature condition. One is brittle fracture inside Ag3 Sn plate itself; the other is interfacial fracture of Ag3 Sn plates and the IMC layer. Moreover, the fractures of large Ag3 Sn plates induce the decrease of mechanical properties on Sn-3.8Ag-0.7Cu solder ball. The critical cooling rate of large Ag3 Sn plate formation is also investigated.

Copyright © 2005 by ASME

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