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Transient Analysis on Hygroscopic Swelling Characterization Using Sequentially Coupled Moisture Diffusion and Hygroscopic Stress Modeling Approach

[+] Author Affiliations
Jiang Zhou

Lamar University

Tong Yan Tee, Xueren Zhang

STMicroelectronics

Paper No. IMECE2005-81847, pp. 107-114; 8 pages
doi:10.1115/IMECE2005-81847
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

One of the challenges for the hygroscopic swelling characterization is to investigate the impact of non-uniform moisture distribution across the specimen using currently available metrologies. Our recent studies have shown that the current averaged approach might overestimate the coefficient of hygroscopic swelling as much as 250%. In our previous analysis, however, the hygroscopic stress induced deformation has not been taken into consideration. As a matter of fact, due to non-uniform moisture distribution during the test, the total measured deformation includes two parts—one is from the hygroscopic swelling itself, and the other is from the hygroscopic stress induced deformation. This paper provides a comprehensive study on the impacts of non-uniform moisture distribution and the effect of hygroscopic stress by using a sequentially coupled moisture diffusion and hygroscopic stress modeling approach. The results show that the hygroscopic stress induced displacement is relatively small, although the elastic strain caused by the hygroscopic stress accounts for about one third of the total strain. The results in our previous study are proved to be acceptably accurate, even through the hygroscopic stress induced deformation is neglected in the previous analysis.

Copyright © 2005 by ASME

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