Full Content is available to subscribers

Subscribe/Learn More  >

Evaluation of Bare Die Chip Reliability Due to Underfill Materials During Mechanical Actuation and Thermal Cycling

[+] Author Affiliations
Arv Sinha

IBM Corporation

Paper No. IMECE2005-81482, pp. 87-91; 5 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


Use of underfill materials to encapsulate ball grid arrays (BGAs) or chip scale packages (CSPs) have become very important in increasing the reliability of area array packages [1]. Underfill enhances the reliability of flip-chip devices by distributing the thermo-mechanical stresses [2, 3]. These stresses are generated due to mechanical actuation and coefficient of thermal expansion mismatch (CTE) [3]. They are required due to high power density of the current chip design to achieve fine bond line at the thermal interface material in order to dissipate heat. In this paper, details of reliability assessment using the finite element method and actual test data will be presented and discussed.

Copyright © 2005 by ASME
Topics: Reliability



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In