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Mechanical Reliability Evaluation of Chip Scale Power Package

[+] Author Affiliations
Kaushik Ghosh, F. Patrick McCluskey

University of Maryland

Victor A. K. Temple

Silicon Power Corporation

Paper No. IMECE2005-81111, pp. 77-85; 9 pages
doi:10.1115/IMECE2005-81111
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

ThinPak™ is a highly volumetrically efficient technology for packaging high power semiconductor devices for a wide range of applications. Its elimination of wirebonds lowers thermal and electrical resistivity and impedance, while its two sided solder attach enhances cooling, thus promising improved performance and reliability. In this study, the thermomechanical durability of the ThinPak™ module was investigated using physics-of-failure modeling and accelerated thermal cycle testing. Post-test analysis of samples indicated that failure occurred first in the eutectic solder used to attach the ThinPak™ to the DBC substrate. The high lead solder in the ThinPak™ itself was very robust against failure. Viscoplastic stress analysis combined with Coffin-Manson damage modeling was used to quantify creep-fatigue accumulation. The failure criterion of a 20% increase in forward voltage drop was used in conjunction with stress analysis to assess the time to failure at the DBC/ThinPak™ interface. The calibrated constants for the fatigue ductility and exponent were then used to assess the life of the assembly for different temperature loading conditions.

Copyright © 2005 by ASME
Topics: Reliability

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