Full Content is available to subscribers

Subscribe/Learn More  >

Assessment of Influence and Analysis of Mechanism on the Reliability for Solder Joints of Electronic Device

[+] Author Affiliations
Qiang Yu, Jae-Chul Jin, Hirokazu Abe, Takahiro Koyama, Tadahiro Shibutani, Masaki Shiratori

Yokohama National University

Paper No. IMECE2005-80887, pp. 71-76; 6 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


In recent years, the development of the electronic device using the semiconductor is remarkable. In current advanced technology, it has succeeded in making the package which size is almost equal to the IC chip. Moreover for miniaturization and high integration of the electronic device, it has been fined in soldered joints divisions. As a result, the strength reliability become an important problem, since the thermal fatigue fracture is generated by thermal expansion difference between package and printed-circuit board. However, it is difficult to guarantee quality during the design stage, because it is hard to know which design factors will prolong the fatigue life. So it is needed that a quantitative evaluation technique of the relation between the design change and the thermal fatigue reliability. The authors introduced a simple approach to help solving the design and development of a package system by using the SDSS (statistical design support system) and FEM (Finite Element Method) analysis. In this study, in order to improve the reliability, evaluations of the influence of various design factors on the reliability of BGA (Ball Grid Array) soldered joints were carried out. By using the total equivalent inelastic strain range obtained by FEM analysis, the sensitivity is calculated and the authors got the influence of each design factor. With the results, the design engineers can know the rate of each factors’ effect on the reliability of solder joints and they can use the results to assess the reliability of their design from the concept design stage. Consequently, it can be expected that almost reliability problems can be avoided at the beginning, and it will lead a great advantage of shortening design period and slashing costs. And this will lead design engineers to come up with more new ideas.

Copyright © 2005 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In