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Evaluation of Creep Properties in Soldering Ball by Nanoindentation Creep

[+] Author Affiliations
Tadahiro Shibutani, Qiang Yu, Masaki Shiratori

Yokohama National University

Paper No. IMECE2005-80160, pp. 51-55; 5 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


In this paper, the behavior the behavior of creep deformation in low melting point alloy during a nanoindentation test was examined. Nanoindentation creep test was performed for eutectic tin-lead solder ball. Estimated creep exponent from the relationship between hardness and indenter dwell-time decreases as a function of time. The morphology of indented area shows that the transition from the deformation due to the tip in the early stage to another one in the last stage. Each grain near the indenter tip was transformed in the last stage. Stress analysis using a finite element method reveals that relaxation of equivalent stress progresses rapidly and the residual hydrostatic stress is dominant. Then, the gradient of the residual hydrostatic stress affects the chemical potential on grain boundaries and diffusion creep is activated. Therefore, the transition from the power-law creep to diffusion creep takes place during the nanoindentaion creep.

Copyright © 2005 by ASME



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