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Board Strain Analysis to Investigate Chassis Design Effects

[+] Author Affiliations
Frank Z. Liang, Larry M. Palanuk, Richard L. Williams, Paresh Daharwal

Intel Corporation

Paper No. IMECE2005-80086, pp. 37-44; 8 pages
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME


A circuit board response was used to characterize five chassis that were manufactured by five different suppliers to two form factors: slim and mid-tower designs. The board responses were compared to that in a reference test chassis. All the chassis were shocked to the same input. The board response was characterized by strain gauges mounted on the PCB around critical BGA components. The board strains measurements were able to detect the manufacturing variability of the chassis fabricated and was used to identify the second level interconnection (SLI) risk for BGA placement at the measured location. This paper presents an empirically driven methodology comparing supply line chassis variation and their direct affect on BGA SLI reliability and the need to revise the procurement specification to ensure repeatable and predictable BGA or any critical SLI performance.

Copyright © 2005 by ASME



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