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Effects of Dwell-Time and Ramp-Rate on The Thermal-Fatigue Life of SnAgCu Joints

[+] Author Affiliations
Walter Dauksher, John Lau

Agilent Technologies, Inc.

Paper No. IMECE2005-79984, pp. 23-28; 6 pages
doi:10.1115/IMECE2005-79984
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

Finite element analysis examines lead-free part-on-board accelerated thermal environments comprised of ramp and dwell times lasting between 5 and 15 minutes. The accumulated creep strain energy density is determined for each environment and used to evaluate cost-effective accelerated test environments.

Copyright © 2005 by ASME

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