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Reliability Analysis of WLCSP Using Tie-Release Crack Prediction Finite Element Technique

[+] Author Affiliations
Chang-Chun Lee, Kuo-Ning Chiang

National Tsing Hua University

Paper No. IMECE2005-79717, pp. 7-12; 6 pages
doi:10.1115/IMECE2005-79717
From:
  • ASME 2005 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Orlando, Florida, USA, November 5 – 11, 2005
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4217-7 | eISBN: 0-7918-3769-6
  • Copyright © 2005 by ASME

abstract

For the purpose of enhancing the solder joint reliability of a wafer level chip scaling package (WLCSP), the WLCSP adopted the familiar design structure where both the stress compliant layer with low elastic modulus and the dummy solder joints are considered as structural supports. However, the predicted fatigue life of the solder joints at the internal part of the packaging structure using the conventional procedures of finite element simulation are higher than under actual conditions as a result of the perfect bonding assumption in the modeling. In this research, in order to improve the thermo-mechanical reliability of the solder joints, a node tie-release crack prediction technique, based on non-linear finite element analysis (FEA), is developed and compared with the estimation of the solder joint reliability using conventional methodology. The predicted results of reliability, using the novel prediction technique, show a lower fatigue life of the solder joint than that when using conventional one when the fracture regions in the dummy solder joints are simulated under quasi-steady state. At the same time, the result of the thermal cycling test also shows good agreement with the simulated result when using the proposed node tie-release crack prediction analysis.

Copyright © 2005 by ASME

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