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Numerical Simulation on Phase-Change Heat Transfer Within Microencapsulated Phase Change Material

[+] Author Affiliations
Yu Rao, Guiping Lin

Beihang University, Beijing, P. R. China

Paper No. HT2003-47023, pp. 187-193; 7 pages
  • ASME 2003 Heat Transfer Summer Conference
  • Heat Transfer: Volume 1
  • Las Vegas, Nevada, USA, July 21–23, 2003
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-3693-2 | eISBN: 0-7918-3679-7
  • Copyright © 2003 by ASME


A source item-based computation model is developed for analysing phase-change heat transfer within Microencapsulated PCM suspending in a flowing carrier fluid to enhance convective heat transfer, with the consideration of phase-change temperature range and varying thermal properties. Solution is obtained by developing a control volume-based finite difference code, in which TDMA method combined with under-relaxation is used to solve a strong nonlinear equation. The code developed for this study can be used for evaluating Microencapsulated PCM suspension and instructing the preparation of Microencapsulated PCM.

Copyright © 2003 by ASME



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