0

Full Content is available to subscribers

Subscribe/Learn More  >

Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications

[+] Author Affiliations
Liang Chai, Aziz Shaikh, Vern Stygar

Ferro Electronic Material Systems, Vista, CA

Paper No. IPACK2003-35134, pp. 827-831; 5 pages
doi:10.1115/IPACK2003-35134
From:
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME

abstract

Low Temperature Co-fired Ceramic (LTCC) materials are widely used in ceramic packaging and interconnect applications, such as RF receiving modules for next generation handsets and T/R modules for satellite communications. The application frequency spans from low GHz to 100+ GHz. A variety of techniques must be used to characterize dielectric properties (loss tangent and dielectric constant) of LTCC in the wide frequency range. These techniques include the parallel plate capacitor method from DC to several MHz, cavity methods in x-band, and open resonator techniques for frequencies up to 100+ GHz. LTCC is a multi-layer ceramic technology, which offers capability for low cost manufacturing, realizing 3D structures, and embedding passive components. Both strip line and microstrip types of transmission line structures can be conveniently manufactured using LTCC material systems. As an important performance parameter, microstrip loss can be characterized using the ring resonator technique. Both LTCC and metal conductors contribute to the microstrip loss. At microwave and mm-wave frequencies, metal losses become significant, although low resistance silver conductor can be used. The metal loss may be divided into two categories: one is the resistive loss and other is surface roughness loss. A photo imaging technique has been introduced which patterns the microstrip, reducing the surface loss. In this paper, the techniques for measuring both dielectric properties of A6 LTCC and microstrip properties of A6 LTCC with conductor systems will be reviewed. Characterization results of the dielectric constant and loss tangent of A6 from near DC to 100 GHz will be presented. Microstrip losses, measured for A6 LTCC with both gold and silver metallization up to 40 GHz, are compared to those computed using the closed form equations and experimentally determined dielectric and conductor properties. The calculated effective microstrip permitivity and attenuation compare well to those from measurements.

Copyright © 2003 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In