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Flexible Electronic Devices From Hot Embossing Materials Transfer

[+] Author Affiliations
Ashante’ Allen, Andrew Cannon, William King, Samuel Graham

Georgia Institute of Technology, Atlanta, GA

Paper No. NANO2005-87068, pp. 75-76; 2 pages
doi:10.1115/NANO2005-87068
From:
  • ASME 4th Integrated Nanosystems Conference
  • Design, Synthesis, and Applications
  • Berkeley, California, USA, September 12–14, 2005
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4208-8 | eISBN: 0-7918-3771-8
  • Copyright © 2005 by ASME

abstract

The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing [1,2] as well as dry transfer techniques [3–5]. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.

Copyright © 2005 by ASME

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