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Ultra-Thin and High-Density Packaging Using Both Sides Flip Chip Technology

[+] Author Affiliations
Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino

Matushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan

Hideo Koguchi, Nipon Taweejun

Nagaoka University of Technology, Nagaoka, Niigata, Japan

Paper No. IPACK2003-35066, pp. 819-826; 8 pages
  • ASME 2003 International Electronic Packaging Technical Conference and Exhibition
  • 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
  • Maui, Hawaii, USA, July 6–11, 2003
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-3690-8 | eISBN: 0-7918-3674-6
  • Copyright © 2003 by ASME


We have developed a high-density packaging technology by using a thin IC and a thin substrate and bonding it by new flip chip technology. Numerical analysis with the finite element method (FEM) as well experiments clearly showed that deflection of the IC and reliability were affected by the IC thickness. Consequently, reliability could be improved by reducing IC thickness. The dependency of the life in single-sided CSP and both-sided CSP on the thickness of IC and substrate could be expressed using a normal stress in the thickness direction and shear stress in the vertical cross section, respectively. Moreover, a both-sided flip chip approach solved the problem of warpage. A high-capacity memory card of 512 MB was put to practical use by applying these results. This increased the Si density by four times over that of a conventional chip-size package (CSP).

Copyright © 2003 by ASME



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